วันอังคารที่ 7 กันยายน พ.ศ. 2553
Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages
- Paperback: 560 pages
- Publisher: Prentice Hall (October 19, 2000)
- Language: English
- ISBN-10: 0130289043
- ISBN-13: 978-0130289049
- Product Dimensions: 9.4 x 7 x 1.4 inches
Editorial Reviews
Product Description
Gives engineers the theory and practical methods needed to model and simulate high-speed connections and predict real-world performance with interconnects and packages. Contains in-depth reviews of a host of topics, including crosstalk, generalized termination schemes and differential signaling. DLC: Signal processing--Digital techniques--Computer simulation.
From the Inside Flap
PrefaceEffects of interconnects on the electrical performance of digital components, such as microprocessors, have historically been small enough to handle with simple rules of thumb. As clock rates, bus widths, and bus speeds have increased, packaging and interconnects have more importance and in some cases actually limit or define the system, where silicon performance is usually found to be the gating factor. This role reversal will become more common, and it may be that packaging and interconnects dominate electrical considerations at some point in the future as networks become more prominent.The relatively recent growth of packaging and interconnects as significant issues in electrical performance means that relatively few resources exist for learning and training. Much of it exists as scattered applications notes, many of which are quite useful but are sometimes somewhat dated (i.e., notes on ECL rather than CMOS) or are from the less accessible technical literature. Since many organizations are newly finding the need for expertise in the field, in-house experts may not be available to act as mentors.
This book represents my efforts at collecting and deriving the necessary material to support a career in digital signal integrity modeling and simulation. A huge part of such a job is package and interconnect modeling from electromagnetic simulation and/or measurements. By necessity, the book spans a broad spectrum of techniques, including electromagnetic simulation, transmission line theory, frequency-domain modeling, time-domain modeling, analog circuit simulation, digital signaling, and some architectural issues, to put it all in perspective. Such a broad technological reach makes for a very interesting and challenging job. Since I believe that the number of engineers working this area will need to increase dramatically to support the technological trends, I hope that this book will provide a sufficient set of tools to help engineers succeed in this field.
The goal of the book is to provide detailed introductory material that is self-consistent and self-contained. As such, there are very few references. There is nothing in the book that is new to the field, so technical credit must go to the innumerable contributors to the technical literature, application notes, and standards.
The book is organized to move gradually from broad, general topics to specific modeling techniques. Particular emphasis is placed on rigorous derivation and on multiconductor interconnects. Chapter discusses the role of signal integrity in digital systems. Chapters and then cover issues in signaling and signal integrity. Chapters through cover detailed concepts in basic passive circuit components, with particular emphasis on multiconductor interconnects. One of the more difficult aspects of detailed simulations in signal integrity is the need to model multiconductor interconnects such as sockets, packages, edge connectors, and buses. Experimental characterization of interconnects is covered in chapter, where emphasis is on measurements of very small parasitics for high leadcount interconnects.
Interconnect modeling is covered in chapters and, where distinction is drawn between low-frequency lumped modeling and high-frequency wideband modeling. Because interconnects are often physically small, lumped modeling is often the optimal choice. Finally, chapter provides extended coverage of signal integrity topics and represents advanced application of material and concepts from prior chapters.
The manuscript was typeset using running under Linux on a PC clone based on a Tyan motherboard with a Cyrix processor. The text was prepared using a custom text editor written in Tcl/Tk. Circuit simulations used Berkeley SPICE 3f4. The figures were prepared using Xfig. Symbolic manipulation usedMathematica. Brian Young
Austin, Texas
วันพุธที่ 1 กันยายน พ.ศ. 2553
Sensors and Control Systems in Manufacturing
Second Editionquot;McGraw-Hill Professional 2009 | ISBN-10: 007160572X | 624 Pages | File type: PDF | 6,5 mb
A Comprehensive Guide to Sensors and Control Systems in Manufacturing
Thoroughly updated with cutting-edge technologies, this detailed resource offers proven methods for effectively evaluating, selecting, and implementing sensors and controls to ensure error-free manufacturing environments. Sensors and Control Systems in Manufacturing, Second Edition offers step-by-step guidance on applying sensors to measure product parameters, control manufacturing, develop precision manufacturing systems, and generate and control motion. Real-world examples are included throughout to demonstrate successful industrial applications.
Coverage includes:
The latest sensor technologies, such as MEMS, photo-, bio-, nano-, and LED sensors
Sensor classification and types, including photoelectric, inductive and capacitive proximity, confocal microscropy, and laser sensors Fiber optics in sensors and control systems Networking of sensors and control systems in manufacturing Sensors and control technology in computer-integrated manufacturing Advanced sensor technology in precision manufacturing applications Industrial sensors and control Sensors in flexible manufacturing systems
Communicationsindexing, transmission, and signal processing SpectRx(tm) sensing technology
Manufacturing operation and control through financial planning
Coverage includes:
The latest sensor technologies, such as MEMS, photo-, bio-, nano-, and LED sensors
Sensor classification and types, including photoelectric, inductive and capacitive proximity, confocal microscropy, and laser sensors Fiber optics in sensors and control systems Networking of sensors and control systems in manufacturing Sensors and control technology in computer-integrated manufacturing Advanced sensor technology in precision manufacturing applications Industrial sensors and control Sensors in flexible manufacturing systems
Communicationsindexing, transmission, and signal processing SpectRx(tm) sensing technology
Manufacturing operation and control through financial planning
วันอังคารที่ 31 สิงหาคม พ.ศ. 2553
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