Toyota Supply Chain Management

 

• Hardcover: 240 pages
• Publisher: McGraw-Hill; 1 edition (May 14, 2009)
• Language: English
• ISBN-10: 0071615490
• ISBN-13: 978-0071615495
• Product Dimensions: 9.1 x 6.2 x 0.9 inches 

Editorial Reviews

Product Description

The Toyota Production System is the benchmark used throughout the world for “lean” thinking. Now you can model your own processes after those of the company that “wrote the book on supply chain management.”
Written by two experts on the subject, along with a former Toyota senior executive, this book details the most celebrated supply chain operation in the world to help you form an integrated, synchronized system that will be the envy of your industry.
You will find key insight into the logic behind every point of Toyota’s supply chain, along with both the tactics and strategies you can use to build an outstanding system of your own. Toyota Supply Chain Management explains how to achieve balance and efficiency by focusing on:

• Variety: Determine your variety of offerings based on operational efficiency and market demand
• Velocity: Maintain a steady flow through all processes of the supply chain
• Variability: Manage inconsistencies carefully to reduce cost and improve quality
• Visibility: Ensure the transparency of all processes to enable continuous learning and improvement

The authors provide valuable insider tips and offer hands-on guidance for improvingproduction and operations in a variety of industries, including health care, insurance, banking, credit processing, and retailing.
With careful attention paid to every aspect of the subject—from principles and theories to operations and best practices—Toyota Supply Chain Management is the most comprehensive, insightful guide to forging a world-class supply chain system.

From the Back Cover

Top management secrets to building a world-clas supply chain Three industry insiders cover every link in Toyota’s supply chain, explaining the operations and the logic behind them. Toyota Supply Chain Management will help you design and oversee significant improvements to your supply chain, including

• Sales planing
• Production scheduling
• Supplier Management
• Logistics
• Parts ordering
• Demand fulfillment

The authors pool their extensive and well-rounded knowledge to provide “how-to” insights for applying the lessons of Toyota in any industry. Using this book as your guide, you can create operational efficiency by better connecting offices, plants, facilities, and vendors.
Apply the lessons of Toyota to ensure your company leads the race for growth and profits in today’s competitive economy.

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Balanced Scorecards and Operational Dashboards with Microsoft Excel

• Paperback: 480 pages
• Publisher: Wiley; 1 edition (December 22, 2008)
• Language: English
• ISBN-10: 0470386819
• ISBN-13: 978-0470386811
• Product Dimensions: 9.2 x 7.3 x 1.2 inches 

Editorial Reviews

Product Description

Created in Excel, balanced scorecards enable you to monitor operations and tactics, while operational dashboards is a set of indicators regarding the state of a business metric or process—both features are in high demand for many large organizations. This book serves as the first guide to focus on combining the benefits of balanced scorecards, operational dashboards, performance managements, and data visualization and then implement them in Microsoft Excel.

From the Back Cover

Create Balanced Scorecards and operational dashboards that drive success Balanced Scorecards help organizations clarify their strategy, translate strategy into action, and successfully execute their strategy. Operational dashboards are critical for monitoring and managing high performance.
This book is a guide for those who define and build these business performance tools: executive sponsors, operational managers, facilitators, and Excel developers. Based on years of experience, these step-by-step methods will help you develop Balanced Scorecards and operational dashboards that drive strategic execution and operational performance.

• Write a strategic Destination Statement that clarifies your vision
• Build a Strategy Map illustrating strategic objectives and the causal links that drive success
• Map operational processes to identify leverage points with the greatest impact
• Identify the "critical few" metrics that drive and measure success
• Gain buy-in with Tactical Action Plans and Implementation Plans
• Build impressive, dynamic Excel scorecards and dashboards using only spreadsheet functions
• Build powerful charts and analyses that aid business decision making
• Develop portable Balanced Scorecards that are secure and easy to maintain

Companion Web site
Download free Excel sample files at www.wiley.com/go/scorecardsanddashboardswithexcel. You can also find additional resources on Balanced Scorecards and operational dashboards at www.torconsulting.com

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Paperless Warehousing - Onion Corporate Project

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Supply Chain Management Issues in Book Publishing

Cargo Loading

Digital Signal Integrity: Modeling and Simulation with Interconnects and Packages

• Paperback: 560 pages
• Publisher: Prentice Hall (October 19, 2000)
• Language: English
• ISBN-10: 0130289043
• ISBN-13: 978-0130289049
• Product Dimensions: 9.4 x 7 x 1.4 inches 

Editorial Reviews

Product Description

Gives engineers the theory and practical methods needed to model and simulate high-speed connections and predict real-world performance with interconnects and packages. Contains in-depth reviews of a host of topics, including crosstalk, generalized termination schemes and differential signaling. DLC: Signal processing--Digital techniques--Computer simulation.

From the Inside Flap

PrefaceEffects of interconnects on the electrical performance of digital components, such as microprocessors, have historically been small enough to handle with simple rules of thumb. As clock rates, bus widths, and bus speeds have increased, packaging and interconnects have more importance and in some cases actually limit or define the system, where silicon performance is usually found to be the gating factor. This role reversal will become more common, and it may be that packaging and interconnects dominate electrical considerations at some point in the future as networks become more prominent.

The relatively recent growth of packaging and interconnects as significant issues in electrical performance means that relatively few resources exist for learning and training. Much of it exists as scattered applications notes, many of which are quite useful but are sometimes somewhat dated (i.e., notes on ECL rather than CMOS) or are from the less accessible technical literature. Since many organizations are newly finding the need for expertise in the field, in-house experts may not be available to act as mentors.

This book represents my efforts at collecting and deriving the necessary material to support a career in digital signal integrity modeling and simulation. A huge part of such a job is package and interconnect modeling from electromagnetic simulation and/or measurements. By necessity, the book spans a broad spectrum of techniques, including electromagnetic simulation, transmission line theory, frequency-domain modeling, time-domain modeling, analog circuit simulation, digital signaling, and some architectural issues, to put it all in perspective. Such a broad technological reach makes for a very interesting and challenging job. Since I believe that the number of engineers working this area will need to increase dramatically to support the technological trends, I hope that this book will provide a sufficient set of tools to help engineers succeed in this field.

The goal of the book is to provide detailed introductory material that is self-consistent and self-contained. As such, there are very few references. There is nothing in the book that is new to the field, so technical credit must go to the innumerable contributors to the technical literature, application notes, and standards.

The book is organized to move gradually from broad, general topics to specific modeling techniques. Particular emphasis is placed on rigorous derivation and on multiconductor interconnects. Chapter discusses the role of signal integrity in digital systems. Chapters and then cover issues in signaling and signal integrity. Chapters through cover detailed concepts in basic passive circuit components, with particular emphasis on multiconductor interconnects. One of the more difficult aspects of detailed simulations in signal integrity is the need to model multiconductor interconnects such as sockets, packages, edge connectors, and buses. Experimental characterization of interconnects is covered in chapter, where emphasis is on measurements of very small parasitics for high leadcount interconnects.

Interconnect modeling is covered in chapters and, where distinction is drawn between low-frequency lumped modeling and high-frequency wideband modeling. Because interconnects are often physically small, lumped modeling is often the optimal choice. Finally, chapter provides extended coverage of signal integrity topics and represents advanced application of material and concepts from prior chapters.

The manuscript was typeset using running under Linux on a PC clone based on a Tyan motherboard with a Cyrix processor. The text was prepared using a custom text editor written in Tcl/Tk. Circuit simulations used Berkeley SPICE 3f4. The figures were prepared using Xfig. Symbolic manipulation usedMathematica. Brian Young
Austin, Texas

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Automated Warehouses

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